19.225 socket outline 21.725 backing plate h h recommended torque is 4 in lb. top view target pcb 7.9 21.725 9.6 0.96 section h-h bga package features: ? directly mounts to target pcb (needs tooling holes) with hardware. ? over 40ghz bandwidth @-1db ? low and stable contact resistance for reliable production yield. ? self inductance under 0.025nh. ? compression plate distributes forces evenly ? easily removable swivel socket lid 0.15mmghz bga direct mount, solderless socket for test applications ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: sg15-bga 14x14mm, 34x34 0.4mm pitch primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 1/10/2015 material: material finish: weight: 17.11 SG15-BGA-1000 drawing scale: 3:1 sheet: 1 of 4 eng: v. panavala file: SG15-BGA-1000 drawn by: v. panavala
1.70 0.10 (x4) non plated mounting hole 0.850 0.025 (x2) non plated alignment hole 13.20 0.40 typ. 6.5250.025 6.6000.025 1.25 1.25 18.762 socket outline 0.27 pad 5.82250.0250 3.28250.0250 8.36250.0350 (x4) 8.36250.0350 (x4) 21.7250 backing plate outline note: bga pattern is not symmetrical with respect to the mounting holes target pcb recommendations total thickness: 1.6mm min. plating: enipig, solder finish, hard gold pcb pad height: same or 0.001"-0.002" lower than solder mask is acceptable solder mask opening: 0.013" note: full bga pattern shown. please adjust pattern according to individual requirements. ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: recommended pcb layout primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 1/10/2015 material: material finish: weight: 17.11 SG15-BGA-1000 drawing scale: 5:1 sheet: 2 of 4 eng: v. panavala file: SG15-BGA-1000 drawn by: v. panavala
e d e e b a1 0.15 m c a b 0.05 m c a b a a1 a detail a scale 16 : 1 c a1 corner 0.10 c 0.10 c 1. dimensions are in millimeters. 2. interpret dimensions and tolerances per asme y14.5m-1994. 3. dimension b is measured at the maximum solder ball diameter, parallel to datum plane c. 4. datum c (seating plane) is defined by the spherical crowns of the solder balls. 5. parallelism measurement shall exclude any effect of mark on top surface of package. note: full bga pattern shown. please adjust pattern according to individual requirements. dim minimum maximum a 2.5 a1 0.15 0.23 b 0.20 0.30 d 14.0 bsc e 14.0 bsc e 0.4 array 34x34 pin count 1156 ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: compatible bga primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 1/10/2015 material: material finish: weight: 17.11 SG15-BGA-1000 drawing scale: 5:1 sheet: 3 of 4 eng: v. panavala file: SG15-BGA-1000 drawn by: v. panavala
2 3 1 10 11 4 13 12 9 5 6 8 7 14 21.725 2.50 (x4) 2.50 (x4) 1.610.05 (x4) 11.58 1.27 5.50 4.58 r1.27 all 11 3.50 1.59 insulation plate item no. description material 1 ghz swivel socket lid, 14mm ic 7075-t6 aluminum alloy 2 compression screw m10 7075-t6 alumium alloy 3 #0-80 shoulder screw, 0.062" thread length stainless steel (303) 4 #0-80 x .375 lg, soc hd cap screw, alloy stl, blk oxide alloy steel 5 backing plate, 21.725 x 21.725 7075-t6 aluminum alloy 6 compression plate, 13.95 x 13.95 7075-t6 aluminum alloy 7 alignment pin 1/32" dia. x 1/8" lng chrome stainless steel 8 insulation plate fr4 standard 9 target pcb material 10 socket base bga 14x14 7075-t6 aluminum alloy 11 customer's bga 0.4mm pitch 34x34 array 14mm high temp fr4 12 elastomer guide 14mm ic 0.15mm thk kapton polyimide/cirlex 13 ball guide 34x34 0.4mm pitch kapton polyimide 14 0.15mm thick, 0.05x 0.05mm pitch, 50mm sqr, z-axis conductive angled elastomer 20 micron dia gold plated brass filaments arranged symettrically in a silicon rubber (63.5 degree angle), thickness: 0.5mm ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: socket specification primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 1/10/2015 material: material finish: weight: 17.11 SG15-BGA-1000 drawing scale: 1:1 sheet: 4 of 4 eng: v. panavala file: SG15-BGA-1000 drawn by: v. panavala
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